Laser Processing of Brittle Nonmetallic Materials
Laser as an advanced processing tool, has more and more widely in the industrial production plays a pivotal role. With the continuous development of burning laser pointer technology, its by virtue of the processing quality, processing complexity, processing efficiency and clean environmental protection and other advantages, not only in the stainless steel, copper, alloy and other metal materials processing favored, but also in the glass , Ceramics, sapphire, semiconductor silicon wafer, PCB board and other non-metallic materials processing highlights a unique advantage.
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In the field of non-metallic processing, thin-brittle materials, laser processing of concern. With the development of consumer electronics products such as smartphones, LED lighting, tablet PCs, and wearable devices, glass, sapphire and ceramics have been widely used with their own unique quality properties, such as hardening Glass used as a smart phone display; hard and chemically stable ceramic for the production of electronic components substrate and insulation materials; hard scratch-resistant sapphire for LED substrate, mobile phone camera protection glass, smart phone display, Smart watch cover glass and so on.
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Glass, ceramics, sapphire and other brittle non-metallic materials, precision machining, usually using ultra-fast 10mw laser pointer. Ultrafast laser pulse duration is extremely short, in nanoseconds, picoseconds and even femtosecond, the role of moderate laser energy on the surface of the material, by breaking the material chemical bond to achieve the purpose of material removal, in this process, the laser energy It is too late to pass around the processing range, the process has ended, so the heat is almost negligible, the material does not produce thermal damage.
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In the processing requirements, the above-mentioned applications usually require the use of very sophisticated cutting, drilling and grooving processes on these brittle and brittle materials, which makes the traditional milling, grinding and grinding processes Of the challenge, because the material is extremely thin and very brittle, the process of application due to contact with the application of any stress on the material, may lead to material fragmentation, and ultimately scrapped. With the application of these brittle materials in products such as LEDs, smart phones, wearable equipment, etc., the laser, laser systems and related research institutions that are working on such brittle materials are also increasing, and their efforts have This kind of brittle materials high power laser pointer processing technology continues to develop.
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Strengthen the unique properties of glass, sapphire and other brittle, transparent materials, which will lead to the growing use of these materials in markets such as consumer electronics, medical equipment, integrated circuits, construction, automotive, aerospace and other markets. Especially in the smart phone, can wear electronic products, led by consumer electronics products, to strengthen the application of glass and sapphire, has a lot of room for growth. Therefore, the market for brittle materials, laser processing needs are very good.
While the market is demanding high demand from the market to reduce processing steps, reduce material waste and dry process and other factors continue to drive, is also a strong impetus to the laser manufacturers and laser system integrators to provide continuous discussion, asking them not only to provide Traditional mechanical processing alternatives, but also continue to enhance the overall performance of 5mw laser pointer processing solutions to the processing quality, product yield, processing speed and mass production has been a breakthrough.